Features:

• Integrates a focused infrared top heater, split-vision alignment, pre-heater, and soldering Iron into one sophisticated reworking system.
• Micro-processor controlled system with full digital display of time, temperature and airflow parameters for maximum performance.
• Closed loop control accurately maintains the desired temperature at board level.
• Innovative three axis positioning system using precise micrometers for BGA alignment.
• Split vision technology with color LCD display aids in the proper alignment of the BGA.
• Precision solder. Combination of pre-heater and top heater to reach reflow temperature effectively minimizes overheat or under heating.
• Fast response IR lamp technology gives accurate and ample heating suitable for various IC packages and sizes.
• Compatible with lead-free and standard solder process.
• Integrated lead-free compatible soldering iron.
• Versatile PCB holder that can accommodate PCBs sizes of up to 280 x 430 mm.
• BGA 9000A -Manual pick and place of ICs with the adjustment ladder.
• BGA 9300 - Automated pick and placement of BGAs with simple button controls.