Features:

• Microprocessor-controlled ESD safe unit, utilizes infrared heat wave technology.
• Enhanced pre-heating area to fit large PCBs and minimizes board warping
• Easy-to-adjust pre-heat temperatures with digital display.
• Built in extra temperature sensor for more accurate monitoring of board temperature.
• Internal temperature sensor for stable temperature measurements.
• Closed loop system for precise temperature control and monitoring at board level.
• Profile adjustment functionality for automating reworking tasks under user defined temperature and time settings.
• Temperature and Profile settings are stored into CPU memory for easy configuration.
• Compatible for use with either hot air or IR top heating systems.